During the DesignCon 2017 exhibition, BiFAST demonstrated a live running 100 Gb/s per channel OSFP cable, displaying the real-time BER measurements. [demonstrators]
The performance of the Samtec ZRay interposer was shown during the DesignCon 2017 exhibition using a BiFAST transmitter IC to generate 56 Gb/s NRZ and displaying the NRZ eye on an oscilloscope. [demonstrators]
To fill the void in the industry to model and simulate duobinary signaling, Xilinx, Keysight and Cisco have teamed up with BiFAST to develop an IBIS-AMI model of link systems using duobinary signaling. Furthermore, Keysight published this as a White Paper. [publications]
For his PhD thesis A Duobinary Receiver Chip for 84 Gb/s Serial Data Communication, BiFAST CEO Timothy De Keulenaer was awarded the Nokia Bell Scientific Prize by the FWO/FNRS on November 30th 2016, in recognition of the PhD thesis that brings the most original contribution in the field of information and communication technology.
The ECOC 2016 post deadline Paper
Graduated in 2010 as a Master of Science in applied electrical engineering at Ghent University where he received his Ph.D. degree in applied electrical engineering in 2015. Timothy has gathered four years of experience in the field of high-speed transceivers and duobinary. He is the author of several papers on high-speed SERDES systems and the co-inventor of three patents related to duobinary.
Graduated in 2010 as a Master of Science in applied electrical engineering at Ghent University, his expertise encompasses FPGAs and the integration of VCOs and CDRs for 40Gb/s. His role within the BiFAST project mainly involves the exploration of business opportunities and the development of digital blocks in the next transceiver generation.
Graduated in 2010 as a Master of Science in applied electrical engineering at Ghent University where he received his Ph.D. degree in applied electrical engineering in 2015. He is responsible for the technology development within the BiFAST project in which his focus lies on further integration of a duobinary transceiver.
Graduated in 2010 as a Master of Science in applied electrical engineering at Ghent University where he received his Ph.D. degree in applied electrical engineering in 2014. He leads the R&D and testing efforts within the BiFAST project and is currently working on the further development of a complete duobinary transceiver.
Within the BiFAST project a duobinary transceiver chipset has been developed which has achieved data rates ranging from 40 Gb/s up to 100 Gb/s across several types of channels (backplane, twinaxial cable, ...). Information on this chipset can be found in the datasheet and application note. A commercial (packaged) version of this chipset will become available in 2017.
In collaboration with Amphenol, BiFAST showed single-lane 100 Gb/s communication running live over a 1m OSFP cable built with
Using the BiFAST transceiver, 56 Gb/s NRZ transmission was demonstrated across a
At DesignCon 2016 a new standard in high serial data rates was set by achieving 100Gb/s across a 1.5 m twinaxial 26AWG cable (highest serial data rate ever shown across copper). Furthermore the performance of our current duobinary chipset was confirmed by achieving 56 Gb/s across a 20 inch backplane channel.
The DesignCon 2015 demonstrator showed the superior performance of duobinary on high loss channels by achieving 56 Gb/s over a backplane with 35 dB loss at Nyquist (28 GHz).
At the Bell Labs Future X days a record high serial data rate of 84 Gb/s by means of duobinary was demonstrated to the world. This was done over a channel with 15 dB of loss at Nyquist (42 GHz).
H. Zhang, F. Rao, T. De Keulenaer, K. Ly, R. Pierco and G. Zhang, DesignCon 2017
M. Verplaetse, R. Lin, J. Van Kerrebrouck, O. Ozolins, T. De Keulenaer, X. Pang, R. Pierco, R. Vaernewyck, A. Vyncke, R. Schatz, U. Westergren, G. Jacobsen, S. Popov, J. Chen, G. Torfs, J. Bauwelinck and X. Yin, Journal of Lightwave Technology
X. Yin, M. Verplaetse, R. Lin, J. Van Kerrebrouck, O. Ozolins, T. De Keulenaer, X. Pang, R. Pierco, R. Vaernewyck, A. Vyncke, R. Schatz, U. Westergren, G. Jacobsen, S. Popov, J. Chen, G. Torfs and J. Bauwelinck, ECOC 2016 - Post Deadline Paper
J. Bauwelinck, W. Soenen, B. Moeneclaey, M. Vanhoecke, R. Pierco, R. Vaernewyck, T. De Keulenaer, G. Roelkens, G. Torfs, X. Yin and P. Demeester, Optical Fiber Communications Conference and Exhibition (OFC) 2016
Y. Ban, T. De Keulenaer, Z. Li, J. Van Kerrebrouck et al. IEEE Microwave and Wireless Components Letters, Vol. 25, No. 11, October 02, 2015, pp. 739-741
Y. Ban, T. De Keulenaer, G. Torfs, J.H. Sinsky et al. IET Electronic Letters, Vol. 51, No. 8, April 16, 2015, pp. 617-619
T. De Keulenaer, G. Torfs, Y. Ban, R. Pierco, et al. IET Electronic Letters, Vol. 51, No. 4, February 19, 2015, pp. 343-345